In an effort to increase reliability of microelectronic contacts, and in particular interconnector mechanisms, an integrated analytical, computational, and experimental methodology for studying microelectronic contacts is applied and described in this paper. Analytical and FEM techniques are utilized for modeling microelectronic contacts as springs at static equilibrium electrostatically actuated by parallel plate capacitor configurations. In order to obtain reliable results for experimental examinations, modeling results are utilized to predict experimental observations, specifically, when optoelectronic metrology techniques are utilized for characterizations. Experimental observations show good correlation with the modeling results, therefore, demonstrating the effectiveness of the integrated methodology for improving the reliability of microelectronic contacts.