Robin H. Liu, Jianing Yang and Piotr Grodzinski Motorola Labs Maciej Z. Pindera and Mahesh Athavale CFD Research Corporation

Thomas Glatzel (1), Christian Litterst (1), Claudio Cupelli (1), Timo Lindemann (1), Christian Moosmann (2), Remigius Niekrawietz (1), Wolfgang Streule (1), Roland Zengerle (1), Peter Koltay (1) - (1) Laboratory for MEMS Applications, Department of Microsystems Engineering – IMTEK, University of Freiburg and (2) Laboratory for Simulation, Department of Microsystems Engineering – IMTEK, University of Freiburg

Sandro De Gruttola, Kevin Boomsma, and Dimos Poulikakos Laboratory of Thermodynamics in Emerging Technologies , Swiss Federal Institute of Technology Yiannis Ventikos Department of Engineering Science, University of Oxford

Jeremy J. Hawkes The University of Manchester Robert W. Barber and David R. Emerson CCLRC Daresbury Laboratory W. Terence Coakley Cardiff University

Talal F. Yusaf, Universiti Tenaga Nacional, Mohd. Zamri Yusoff, Universiti Tenaga Nacional, Yusoff Ali, Universiti Kebangsaan Malaysia, Abdul Halim Shamsuddin, Universiti Kebangsaan Malaysia, Mustafa Kamal Muda, Universiti Tenaga Nacional

Dr. Talal Yusaf Universiti Tenaga Nasional

Liang-Hsuan Lu, Kee Suk Ryu, and Chang Liu University of Illinois in Urbana

A. Bouteville - ENSAM LPMI

David J.Beebe, Michael G. Olsen, Mark A. Stremler and Byung-Ho Jo Beckman Institute for Advanced Science and Technology Ronald J.Adrian and Hassan Aref University of Illinois at Urbana-Champaign David J.Beebe University of Wisconsin-Madison

Hasril Hasini and Mohd. Zamri Yusoff Universiti Tenaga Nasional

Norbert Kockmann, Thomas Kiefer, Michael Engler, and Peter Woias Albert-Ludwig University of Freiburg