Man Lee, The Hong Kong University of Science and Technology, Luthur Siu Lun Cheung, Department of Aerospace Engineering, The University of Arizona, Yi-Kuen Lee, The Hong Kong University of Science and Technology, Yitshak Zohar Department of Aerospace Engineering, The University of Arizona,

J.M. Klein, Y. Bultel, S. Georges - Laboratoire d’Electrochimie et de Physico-Chimie des Matériaux et des Interfaces (LEPMI), M. Pons - Laboratoire de Thermodynamique et de Physicochimie Métallurgique (LTPCM)

Thomas Glatzel (1), Christian Litterst (1), Claudio Cupelli (1), Timo Lindemann (1), Christian Moosmann (2), Remigius Niekrawietz (1), Wolfgang Streule (1), Roland Zengerle (1), Peter Koltay (1) - (1) Laboratory for MEMS Applications, Department of Microsystems Engineering – IMTEK, University of Freiburg and (2) Laboratory for Simulation, Department of Microsystems Engineering – IMTEK, University of Freiburg

David Erickson, Department of Mechanical and Mechanical and Aerospace Engineering, Cornell University

A. Bouteville - ENSAM LPMI

Kunal Jain

Kunal Jain and Chaitanya Bapat ESI

P.C. Sui, Ned Djilali Institute for Integrated Energy Systems and Department of Mechanical Engineering, University of Victoria Victoria, BC, V8W 3P6, Canada Email: jsui@uvic.ca, ndjilali@uvic.ca