Chun-Ping Jen and Yu-Cheng Lin National Cheng Kung University

Chun-Ping Jen, Wei-Da Wu, Chung-Yi Wu and Yu-Cheng Lin National Cheng Kung University Guang-Guo Wu and Chong-Ching Chang Kun Shan University of Technology

Robin H. Liu, Jianing Yang and Piotr Grodzinski Motorola Labs Maciej Z. Pindera and Mahesh Athavale CFD Research Corporation

Mads Jakob Jensen Technical University of Denmark

Peter Schneider, Andre Schneider, Peter Schwarz Fraunhofer Institute for Integrated Circuits

Jun-Ho Jeong and Youn-Suk Choi Korea Institute of Machinery and Materials Young-Jae Shin, Jae-Jong Lee, Kyoung-Taik Park, Eung-Sug Lee, and Sang-Rok Lee KyungWon Tech Corporation

Yung-Chieh Tan, John Collins, and Abraham P. Lee University of California at Irvine

Liang-Hsuan Lu, Kee Suk Ryu, and Chang Liu University of Illinois in Urbana

Youn-Suk Choi, Young-Ji Kim, Maesoon Im, and Byoung-Gyun Kim Korea Advanced Institute of Science and Technology Kwang-Seok Yun University of California, Los Angeles Euisik Yoon University of Minnesota, Minneapolis