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Alex Siu Wai Ng,Winky Lap Wing Hau, Yi-Kuen Lee and Yitshak Zohar Hong Kong University of Science and Technology

S.W. Cha and F.B. Prinz Stanford University S.J. Lee San Jose State University Y.I. Park Kumoh National Institute of Technology Y. Saito Honda R&D Co., Ltd

A. S. Rawool, S. K. Mitra, A. Agrawal Indian Institute of Technology, Bombay S. Kandlikar Rochester Institute of Technology

S. W. Cha, Y. I. Park, F. B. Prinz Stanford University S.J. Lee San Jose State University

S.M. Senn and D. Poulikakos ETH Swiss Federal Institute of Technology

S. Krishnamoorthy, J. J. Feng and V. B. Makhijani CFD Research Corporation Chuan Gao, Jin-Woo Choi and Chong H. Ahn Dept. of Electrical & Computer Engineering and Computer Science University of Cincinnati, Cincinnati, OH

Sung Yang, Akif U¨ ndar and Jeffrey D. Zahn Department of Bioengineering, Pennsylvania State University

Jamil El-Ali, Axel Gu1 nther and Klavs F. Jensen Department of Chemical Engineering, Massachusetts Institute of Technology Suzanne Gaudet and Peter K. Sorger Department of Biology, Massachusetts Institute of Technology

Vartan Kurtcuoglu, Dimos Poulikakos and Yiannis Ventikos Laboratory of Thermodynamics in Emerging Technologies

John F. Ladisa, Jr., Ismail Guler, Lars E. Olson, Douglas A. Hettrick, Judy R. Kersten, David C. Warltier, and Paul S. Pagel Medical College of Wisconsin, Clement J. Zablocki Veterans Affairs Medical Center, 4Department of Biomedical Engineering, Marquette University