Robert Wengeler, Michael Heim, Markus Wild, Hermann Nirschl, and Gerhard Kasper Albert-Ludwig University of Freiburg Norbert Kockmann, Michael Engler, and Peter Woias Universität Karlsruhe

Sung-Jin Park, Seok Chung, Hyun-Woo Bang, Dong-Chul Han, and Jun-Keun Chang Seoul National University Chanil Chung Digital Bio Technology Co.

H. Ozgur Demir, Middle East Technical University

Rakesh Kumar and A. Lurdhraj, Aeronautical Development Establishment, DRDO Indrajit P. Chandel and Abraham J. Meganathan ESI Group

Man Lee, Department of Mechanical Engineering, Hong Kong University of Science and Technology, Yi-Kuen Lee, Department of Mechanical Engineering, Hong Kong University of Science and Technology, and Yitshak Zohar, Department of Aerospace and Mechanical Engineering, University of Arizona

Man Lee, The Hong Kong University of Science and Technology, Luthur Siu Lun Cheung, Department of Aerospace Engineering, The University of Arizona, Yi-Kuen Lee, The Hong Kong University of Science and Technology, Yitshak Zohar Department of Aerospace Engineering, The University of Arizona,

J.M. Klein, Y. Bultel, S. Georges - Laboratoire d’Electrochimie et de Physico-Chimie des Matériaux et des Interfaces (LEPMI), M. Pons - Laboratoire de Thermodynamique et de Physicochimie Métallurgique (LTPCM)

Thomas Glatzel (1), Christian Litterst (1), Claudio Cupelli (1), Timo Lindemann (1), Christian Moosmann (2), Remigius Niekrawietz (1), Wolfgang Streule (1), Roland Zengerle (1), Peter Koltay (1) - (1) Laboratory for MEMS Applications, Department of Microsystems Engineering – IMTEK, University of Freiburg and (2) Laboratory for Simulation, Department of Microsystems Engineering – IMTEK, University of Freiburg

David Erickson, Department of Mechanical and Mechanical and Aerospace Engineering, Cornell University

A. Bouteville - ENSAM LPMI