Axisymmetric inductively coupled plasma reactor used for SiO2 deposition in Ar/O2/SiH4 is modeled. The
operating conditions are Pressure = 10 mTorr, Dimension (nozzle to wafer) of 16
cm, RF coil current = 15 A, 13.56 MHz, sonic inlet for Ar/SiH2/O2 and wall
temperature of 300 K.