This tutorial investigates the etching of an Aluminum surface due to
Chlorine gas when a mixture of Argon (Ar) and Chlorine (Cl2) flows over
an Aluminum substrate. Similiar reactors are used in semiconductor fabrication and MEMS applications.
Details
This tutorial will assist the user to do
the following:
Set the model name and title.
Import a DTF grid.
Define a mixture and mixture
properties.
Define a surface reaction mechanism.
Set fluid and solid properties using
volume conditions.
