For high-pressure thermal plasma sustained by direct current, the temperatures of electrons and gases may differ from each other. A 2-temperature approach better accounts for the overall phenomena than the 1-temperature model, in which the thermal equilibrium of electron and heavy species are assumed. The 2-temperature plasma model in CFD-ACE+ includes the electric conduction solution and the sheath model to account for voltage drop. A validation study of the model for a 2-D axi-symmetric (but in 3-D set-up) free burning arc in atmospheric Argon is presented.

The goal of this tutorial is to demonstrate simulations of a 3D ICP with the complex shape of the coil. Engineering problems frequently contain embedded objects or components that are pre-dominantly one-dimensional, i.e., long and slender and with transverse length scales that are much smaller thanthe isotropic length scales of the multi-dimensional space in which the objects are embedded.Those objects are called filaments. Examples include micro-channels, in fluidic devices, optical or electrical leads, resistive electric micro-heaters, or conducting paths in micro-chips.

CFD-VisCART is an automated 3D viscous unstructured adaptive Cartesian grid generation tool for handling complex geometries. This tutorial describes the steps for generating a Cartesian grid with different mesh resolutions on various geometries using CFD-VisCart.

Axisymmetric inductively coupled plasma reactor used for SiO2 deposition in Ar/O2/SiH4 is modeled. The operating conditions are Pressure = 10 mTorr, Dimension (nozzle to wafer) of 16 cm, RF coil current = 15 A, 13.56 MHz, sonic inlet for Ar/SiH2/O2 and wall temperature of 300 K.

This tutorial demonstrates coupled electrical/thermal/structural analysis of a wirebond for power electronic devices. Current flowing through the wires causes heating, which in turn results in thermoelastic stresses in the wires and at the locations where the wire is connected to the IGBT and the diode. Here, we model all three aspects and predict the wire temperature and stress levels.

A 2D axisymmetric RF CCP in Argon is modeled in this tutorial. 

This simulation models a two-dimensional axisymmetric geometry based on a Jipelec RTP reactor. The process considered is polysilicon deposition from silane. The model examines the coupled fluid flow, species transport, radiative heat transfer, and temperature distribution at steady state in the reactor.

This tutorial investigates the etching of an Aluminum surface due to Chlorine gas when a mixture of Argon (Ar) and Chlorine (Cl2) flows over an Aluminum substrate. Similiar reactors are used in semiconductor fabrication and MEMS applications.